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 You are here >> All products >> Pressure Mapping Systems >> Sensor OEM >> piezoelectric film design basis
 
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piezoelectric film design basis
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design basis

There are two main problems that control the selection of the lead connection.

Can the immobilization of the piezoelectric film be connected to the connecting part of the lead wire? This may be a major advantage. For example, it is directly connected to the conductive graphics of the printed board.

Can a piezoelectric film be made in a specific shape and allow for penetration technology? (through MSI's sensor user shape service, these problems can almost be answered "yes"). The same effect can be achieved by a simple test method.

The part of the "problem" is discussed here, and the answer will be given below.


Method


Penetrate the technology here

It refers to the piezo membrane

Line punching (and appending)

The enhancement layer is achieved

Effective thickness and strength

So, so, pressure

Electric film should be designed perfectly

Shape, and misplacement

Line arrangement to prevent

Upper and lower electrodes are inserted

Enter the joint

Short circuit, this can be made by

The manufacturer has finished, and

It can be completed by the user.

Can use rivets or hollow rivet fixed on the dislocation conductive pattern of the piezoelectric film. In the hollow rivets or rivets can be added with the lead wire terminal. The hollow rivets or rivets are mechanically pressed on the displaced electrodes to form a reliable connection point.

If the piezoelectric film is directly fixed on a printed circuit board, you can use "POP" or small solid rivets or hollow rivets piezoelectric film pattern electrode and printed circuit board conductive pattern connected to a wiring operation can be completed. When making conductive ink electrode with screen printing, a small "plated through hole" can be made on one of the misplaced pieces, so that two conductive electrodes become the same side of the piezoelectric film. This is a very convenient way to riveting the pin of the piezoelectric film electrode on the corresponding printed circuit board. If we do not use the technology of "through hole", we can also connect the upper electrode to the conductor under the printed circuit board with the rivet, while the lower electrode is connected to the corresponding conductor on the printed circuit board, while maintaining the electrical contact depends on the pressure of the rivet.

~ the nuts and bolts washers, ring tongue and welding

The lead of the piece can be added with a small nut and a tired bolt.

It is fixed.

Pressure terminal ~ in general, is designed for flexible circuit board technology for crimping terminal piezoelectric film element, good use. Crimp terminals can bring to fixed wire or welding piece is inserted in the corresponding holes in printed circuit board, printed circuit board and welding below (maximum welding time about a few seconds to make the piezoelectric film, and similar overheating) hollow rivet above, crimp terminals are usually designed for specific substrate thickness. The piezoelectric film on its side to lining (polyester reinforced layer) and the crimping terminal adapted to. In addition, the multi-channel integral joint can be pressed into more complex devices, which form the interchangeable joint directly with the other joints.

Not penetrate ~ coated with conductive copper foil tape (3M#1181) available, width from 3mm to 25mm.

Belt used reasonable size (perhaps 1cm or more). The small area is relatively easy to tear off.

First wire welding to the tape, then gently press the membrane lining and adhesive layer, if the area is small, first after welding the connecting sheet is cut to the required size, the excess area as a heat sink. In welding near the joint looks reduces performance. Note: 3M glue is not recommended by the conductive recommend the use of glue and convex version of t

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